H907-DG导热粘接胶 单组份导热环氧树脂结构胶热固化高强度

H907-GD系非溶剂型单组份导热型环氧树脂产品，具有低线膨胀系数及耐高温、抗冲击、耐震动、粘接强度高、硬度高、导热性好等特性。广泛应用于各类电子元器件、电工电器、机电五金、光电饰品、汽配组件等之粘接固定，对于金属、陶瓷、玻璃、纤维制品及硬质塑胶之间的封装粘接有优异的粘接强度；推荐用于电机马达、电路元器件、电器组件、光电元件等粘接固定。 

外观及物性

外观                 粘稠膏状体                  

颜色                 黑色、灰色、白色                

比重（25℃）    1.55-1.65                  

 粘度 （25℃）   40000-60000 cps

  保存期限           25度2个月，5度3个月      

包装                   1KG或5KG   

固化条件：        120℃/1-1.5小时；     

固化后特性

硬    度         Shore D       85-87            

 体积电阻         Ω-cm       4.5×1015

表面电阻          Ω-cm        5.5×1014                    

耐    温            ℃              130-150

抗弯强度          kg／mm2     12                

绝缘破坏电压     kv/mm       20

抗拉强度          kg/mm2        6               

 吸水率           24H %            0.3

导热率            W／M.°C       0.8-1.2

H907-gd is a non solvent single component heat conductive epoxy resin product, which has the characteristics of low linear expansion coefficient, high temperature resistance, impact resistance, vibration resistance, high bonding strength, high hardness and good heat conductivity. Widely used in all kinds of electronic components, electrical appliances, mechanical and electrical hardware, photoelectric jewelry, auto parts, etc. for the bonding of metal, ceramics, glass, fiber products and hard plastic between the packaging and bonding has excellent bonding strength; recommended for motor, electrical components, electrical components, photoelectric components and other bonding and fixation.

Appearance transitivity

Appearance viscous paste

Color black, gray, white

Specific gravity (25 ℃) 1.55-1.65

Viscosity (25 ℃) 40000-60000 CPS

Shelf life: 25 ° 2 months, 5 ° 3 months

Packing 1kg or 5kg

Curing conditions: 120 ℃ / 1-1.5H;

Properties after curing

Hardness Shore D 85-87

Volume resistance Ω - cm 4.5 × 1015

Surface resistance Ω - cm 5.5 × 1014

Temperature resistance 130-150

Bending strength kg / mm2 12

Insulation failure voltage kV / mm 12

Tensile strength kg / mm2 6

Water absorption 24h% 0.3

Thermal conductivity w / m. ° C 0.8-1.2

标签：结构胶导热组份粘接环氧树脂固化