808AB-K-Z Flame Retardant 5-Minute Fast-Cure Structural Adhesive | Connector Sealing Adhesive

Fast-Cure Epoxy Structural Adhesive 808AB-Z

I. Overview:
808AB-Z is a two-part fast-curing epoxy structural adhesive designed for room-temperature or low-temperature rapid curing. The cured bond exhibits high hardness, enabling it to withstand extreme impact and vibration. The bonded layer possesses excellent mechanical properties and electrical insulation, can endure temperature fluctuations and flexural peel stresses, and is non-corrosive. It is widely used for bonding, fixing, repair, and potting of various electronic components, electrical appliances, civil engineering projects, electromechanical hardware, magnetic components, optoelectronic products, automotive parts, as well as metals, ceramics, plastics, rubber, glass, fiber products, crafts, gemstones, etc. It offers rapid positioning and fixation with high bonding strength.

II. Appearance & Properties:

III. Mixing Ratio:
A : B = 1 : 1 or other ratios (by weight)

IV. Pot Life:
The working time after mixing Agent and Hardener depends on the total mixed quantity and operating temperature. Typically, 100g of mixed adhesive has a pot life of approximately 1-2 minutes at 25°C.

V. Curing Conditions:
Generally requires 5-10 minutes at room temperature for curing to complete.