Dongguan Huachuang Insulating Materials Co., Ltd.: Professional Leader in Adhesives and New Material

Since its establishment in 1999, Dongguan Huachuang Insulating Materials Co., Ltd. (including Dongguan Shipai Huachuang Electronic Materials Factory, Guangdong Huachuang Electronic Materials Co., Ltd., Kunshan Huachuang Electronic Materials Factory, and Zhuzhou Huachuang New Materials Technology Co., Ltd.) has focused on the R&D and production of epoxy resin adhesives and UV series products, becoming an industry leader. With exceptional product quality, large-scale production capabilities, and efficient management, we have earned widespread market recognition. Over the years, through relentless effort and continuous innovation, our product portfolio has expanded to cover multiple categories such as epoxy resin potting/sealing/structural bonding, UV-curable adhesives, novel epoxy resins, and specialized epoxy curing agents, offering hundreds of products. These are widely used in electronic components, optoelectronic lighting, electrical appliances, crafts, electromechanical hardware, assembly manufacturing, civil engineering, and many other fields, providing reliable material solutions across industries.

Strict Quality Control Ensures Excellence
The company fully implements ISO 9001 and IATF 16949 quality management systems. Every step—from raw material procurement and production processes to finished product shipment—undergoes comprehensive and stringent quality control, ensuring no substandard products enter the market. Huachuang’s affiliated products have obtained multiple international certifications, including EU SGS, RoHS, CTI environmental certifications, halogen-free (HF), SVHC (REACH) compliance, and UL flame retardant certification (File No.: E304477). Additionally, the company has passed ISO 9001:2018 and IATF 16949:2016 international quality system certifications, earning broad market recognition for outstanding quality.

Customized Services for Diverse Needs
Adhesive Application Development & Technical Support
Our R&D department is dedicated to providing adhesive application development, technical support, and integrated solutions. For any special requirements, our team leverages expertise and experience to tailor adhesives that precisely match customer application scenarios.

Extensive Product Series Covering Broad Applications
Epoxy Resin Adhesive Series

1. One-Part Bonding Adhesives:

• High-hardness, high-strength general-purpose adhesives for electronic transformers, inductors, coils, magnetic components, IF transformers, power supplies, PFC, SMD, circuits, filters, optical components, optoelectronic products (LED/LCD), instruments, metals, motors, rotors, ceramics, stone, etc. Available in black, gray, white.

• Specialized products: Flexible epoxy adhesives, soft adhesives, full-range hardness adhesives; low-resistance conductive adhesives for magnetics, high-permeability magnetic adhesives, low-resistivity semiconductor adhesives, core gap bonding adhesives, conductive carbon/silver adhesives/pastes, SMT red glue, transparent underfill adhesives, modified high-transparency/high-temp/high-strength epoxies, IF transformer center post fillers, low-temp cure adhesives (80°C/30min; 120°C/3-5min), camera module adhesives (70°C/15min), high-temp fast-cure adhesives (120°C/10min; 220-260°C/1-1.5min for automated component pinning).

2. Two-Part (AB) Bonding Adhesives:

• Similar applications to one-part adhesives. Flexible cure times: 5min, 30min, 1hr, 2hr, 8hr. Available in transparent and colored variants.

• Special types: High-temp/high-strength/high-HDT AB adhesives, structural AB adhesives, underwater/low-temp fast-cure AB adhesives, conductive/magnetic/thermally conductive AB adhesives, adhesives for low-surface-energy substrates, and flexible/high-strength/high-temp AB adhesives.

Epoxy Resin Potting Compound Series

1. Two-Part Potting Compounds:

• For transformers, coils, ionizers, power modules, ignition coils, relays, capacitors, PCBs, connectors, filters, controllers, batteries, LED modules, waterproof electronics, etc. Types: General-purpose (colored), high-temp resistant, flexible, transparent, flame-retardant.

• Specialized 3D sign polishing/filling compounds.

2. One-Part Potting Compounds:

• For small components: SMD inductors, network transformers, coils, etc. Features: Elasticity, high flow/penetration, fast cure, high strength.

Optoelectronic & Craft Transparent Epoxy AB Adhesive Series

1. Optoelectronic Transparent AB Adhesives:

• For LEDs, displays, modules. Includes high-transparency/yellowing-resistant (high-temp cure) and room-temp cure types. Also: Flexible AB for LED strips, lighting fixtures, solar panel encapsulation.

2. Craft Transparent AB Adhesives:

• Hard/soft surface coating for crafts, badges, keychains, pressed flowers. Curved/ball surface coating for accessories.

COB Bonding Adhesive Series
For IC protection in electronics, computers, toys, remotes, watches. Types: Hot/cold bonding adhesives, black/red/transparent encapsulation adhesives.

Motherboard Bonding & Other Epoxy Products

1. One-part self-curing adhesives (black/white/green/yellow) for PCB component fixation.

2. Epoxy resins (hot-melt/solvent/AB) for carbon fiber molding.

3. Amorphous core impregnation coatings.

4. Epoxy dust-adhesive coatings for transformer/charger/relay bases.

5. Capacitor/internal encapsulation epoxies; SMD/inductor/resistor potting compounds.

6. Epoxy floor coatings for cleanrooms, plazas, parking lots.

7. Conductive adhesives/carbon pastes/low-R epoxy for magnetics/power supplies.

8. Modified amine transparent curing agents (0.5-8hr cure, high-temp resistant).

UV-Curable Adhesive Series

1. UV Bonding Adhesives:

• For metals, plastics, glass, optics, fiber optics, LEDs, displays, FPCs, medical devices. Includes: UV-curing adhesives (various properties/viscosities/colors), shadowless adhesives, dual-cure (UV-thermal/UV-moisture) adhesives, flexible UV adhesives, surface-cure UV adhesives, solder mask UV, and specialty adhesives for PET/PE/PP/PS/PMMA/PC.

2. UV Coating & Potting:

• Conformal coatings (spray/dip, dual-cure) for PCB protection. UV potting compounds for microelectronics, cable joints. UV crystal resins for crafts.

3. Other UV Products:

• Peelable protective coatings, blue maskants, optical UV adhesives, photosensitive resins (for models/SLA/DLP 3D printing) with high toughness/strength/ultra-fast cure.

R&D Capabilities
Our development team possesses strong R&D capabilities, enabling precise customization of products to meet specific performance requirements and application scenarios. Huachuang Materials is committed to delivering the highest quality products and services to support your success.

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